Jan. 8, 2019
Toray Research Center, Inc.
Notice of collaboration between FUJITSU Advanced Technologies Limited (FATEC) and Toray Research Center, Inc. (TRC).
With the objective to provide engineering services and solutions in device packaging fields for both advanced prototype analyses (real) and simulations (virtual) technologies, TRC and FATEC have started a collaboration of services to meet customers' requests and challenges, with TRC's proven analysis technologies and FATEC's featured packaging and simulation technologies.
TRC has been working on supporting R&D problems and detailed analyses of defectives, based on experienced analyses and evaluations of various materials such as polymer, semiconductor and metals, in the automobiles, IT equipment and electronic devices industries
FATEC has provided mechanical design and manufacturing technologies of the device packaging, with simulations of thermal, mechanical and high-speed transmissions for Fujitsu supercomputers and servers.
With the world class reputations and skills of both companies, FATEC and TRC are ready to support differentiated design, smooth initial manufacturing, state-of-the art process development, and reliable mass production.